3M Glue, Adhesives, Applicators 0401

Description
BONDO FIBERGLASS RESIN, 00401, 0
  • Glue, Adhesives, Applicators - 19-0401-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
BONDO FIBERGLASS RESIN, 00401, 0
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Glue, Adhesives, Applicators - 19-0401-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Glue, Adhesives, Applicators
19-0401-ND
Glue, Adhesives, Applicators 19-0401-ND
BONDO FIBERGLASS RESIN, 00401, 0

BONDO FIBERGLASS RESIN, 00401, 0

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Industrial Adhesives
Product Number 19-0401-ND
Product Name Glue, Adhesives, Applicators
Unlock Full Specs
to access all available technical data

Similar Products

Adhesives - 2391516 - RS Components, Ltd.
TE Connectivity
Adhesives
S1125-KIT-1
Specs
Type / Form Liquid
Use Temperature 302 F (150 C)
View Details
3 suppliers
Thermal silicone pad for CPU heat conduction - SF500 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal silicone pad for CPU heat conduction
SF500
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Dymax Multi-Cure 6-630 UV Curing Adhesive Clear 30 mL MR Syringe - 6-630 30ML MR SYRINGE - Ellsworth Adhesives
Dymax
Dymax Multi-Cure 6-630 UV Curing Adhesive Clear 30 mL MR Syringe
6-630/30SYMR
Specs
Cure / Technology Single Component
Substrate Compatibility Ceramic, Glass; Metal
Viscosity 500 cP
View Details
Advanced Hybrid Sintering Die Attach Solutions - ATROX ® 800HT2V - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Advanced Hybrid Sintering Die Attach Solutions
ATROX ® 800HT2V
Specs
Cure / Technology Thermoset
Features Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details