3X Ceramic Parts Company Limited Zirconia Ceramic Wafer Support Loader

Description
High Precision Zirconia Ceramic Wafer Support Loader Zirconia Ceramic Wafer Carrier Support is highly precision machinind by flapping machine and CNC machined . It is used on the photovaltaic equipment machine to carry the wafer in semiconductor industry . Zirconia ceramic wafer carrier has the characteristics of high temperature resistance, corrosion resistance, wear resistance, high precision, high strength and high cost performance. It is widely used in various fields. The processing methods of zirconia ceramic wafer carrier of inserting machine mainly include grinder grinding and ceramic CNC precision carving. The first is to use the surface grinder to process the shape of zirconia rough embryo. This process can process the complete tooth shape, groove, etc. after grinding by the grinder, the zirconia ceramic wafer support now has a high-precision overall dimension. After finishing this process, it will be transferred to the ceramic CNC machine tool for back-end processing. CNC is mainly used to process the holes on the ceramic top teeth. Here, the problem of ceramic perforation edge collapse should be controlled. If you are careful, the edge will collapse, but it is difficult to recover the edge collapse. At this time, we can adopt the method of drilling a small hole first and then expanding the hole. Similarly, we can reserve more thickness of the zirconia wafer support first, and then go to the grinder to smooth the broken side after machining the hole. At this time, we can achieve the effect of removing the broken edge.
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Description
High Precision Zirconia Ceramic Wafer Support Loader Zirconia Ceramic Wafer Carrier Support is highly precision machinind by flapping machine and CNC machined . It is used on the photovaltaic equipment machine to carry the wafer in semiconductor industry . Zirconia ceramic wafer carrier has the characteristics of high temperature resistance, corrosion resistance, wear resistance, high precision, high strength and high cost performance. It is widely used in various fields. The processing methods of zirconia ceramic wafer carrier of inserting machine mainly include grinder grinding and ceramic CNC precision carving. The first is to use the surface grinder to process the shape of zirconia rough embryo. This process can process the complete tooth shape, groove, etc. after grinding by the grinder, the zirconia ceramic wafer support now has a high-precision overall dimension. After finishing this process, it will be transferred to the ceramic CNC machine tool for back-end processing. CNC is mainly used to process the holes on the ceramic top teeth. Here, the problem of ceramic perforation edge collapse should be controlled. If you are careful, the edge will collapse, but it is difficult to recover the edge collapse. At this time, we can adopt the method of drilling a small hole first and then expanding the hole. Similarly, we can reserve more thickness of the zirconia wafer support first, and then go to the grinder to smooth the broken side after machining the hole. At this time, we can achieve the effect of removing the broken edge.
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Zirconia Ceramic Wafer Support Loader -  - 3X Ceramic Parts Company Limited
Shenzhen City, China
Zirconia Ceramic Wafer Support Loader
Zirconia Ceramic Wafer Support Loader
High Precision Zirconia Ceramic Wafer Support Loader Zirconia Ceramic Wafer Carrier Support is highly precision machinind by flapping machine and CNC machined . It is used on the photovaltaic equipment machine to carry the wafer in semiconductor industry . Zirconia ceramic wafer carrier has the characteristics of high temperature resistance, corrosion resistance, wear resistance, high precision, high strength and high cost performance. It is widely used in various fields. The processing methods of zirconia ceramic wafer carrier of inserting machine mainly include grinder grinding and ceramic CNC precision carving. The first is to use the surface grinder to process the shape of zirconia rough embryo. This process can process the complete tooth shape, groove, etc. after grinding by the grinder, the zirconia ceramic wafer support now has a high-precision overall dimension. After finishing this process, it will be transferred to the ceramic CNC machine tool for back-end processing. CNC is mainly used to process the holes on the ceramic top teeth. Here, the problem of ceramic perforation edge collapse should be controlled. If you are careful, the edge will collapse, but it is difficult to recover the edge collapse. At this time, we can adopt the method of drilling a small hole first and then expanding the hole. Similarly, we can reserve more thickness of the zirconia wafer support first, and then go to the grinder to smooth the broken side after machining the hole. At this time, we can achieve the effect of removing the broken edge.

High Precision Zirconia Ceramic Wafer Support Loader

Zirconia Ceramic Wafer Carrier Support is highly precision machinind by flapping machine and CNC machined . It is used on the photovaltaic equipment machine to carry the wafer in semiconductor industry .

Zirconia ceramic wafer carrier has the characteristics of high temperature resistance, corrosion resistance, wear resistance, high precision, high strength and high cost performance. It is widely used in various fields. The processing methods of zirconia ceramic wafer carrier of inserting machine mainly include grinder grinding and ceramic CNC precision carving. The first is to use the surface grinder to process the shape of zirconia rough embryo. This process can process the complete tooth shape, groove, etc. after grinding by the grinder, the zirconia ceramic wafer support now has a high-precision overall dimension. After finishing this process, it will be transferred to the ceramic CNC machine tool for back-end processing. CNC is mainly used to process the holes on the ceramic top teeth. Here, the problem of ceramic perforation edge collapse should be controlled. If you are careful, the edge will collapse, but it is difficult to recover the edge collapse.

At this time, we can adopt the method of drilling a small hole first and then expanding the hole. Similarly, we can reserve more thickness of the zirconia wafer support first, and then go to the grinder to smooth the broken side after machining the hole. At this time, we can achieve the effect of removing the broken edge.

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Technical Specifications

  3X Ceramic Parts Company Limited
Product Category Specialty Ceramics
Product Name Zirconia Ceramic Wafer Support Loader
Specialty Ceramic Type Zirconia
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