OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component casting/potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and dielectric strength. The Overtec system is a low-pressure molding process that uses thermoplastic molding resin to achieve high quality sealing and protection of components, faster than 2 component potting resins and far lower capital cost than injection molding. Positioned between casting and injection molding technologies, this innovation allows fragile or delicate components to be encapsulated and protected with no risk of damage. The OverTec 5FR resin sticks simply need to be loaded into the OverTec 820-15 glue gun and allowed to reach operating temperature before use, resulting in a simple and clean process with fast cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more.