Encapsulants and Potting Compounds from MacDermid Alpha Electronics Solutions

Underfill Epoxy for protecting assembled chip packages -- ALPHA® HiTech CU21-3240

Underfill Epoxy for protecting assembled chip packages -- ALPHA® HiTech CU21-3240 -- View Larger Image
Underfill Epoxy for protecting assembled chip packages -- ALPHA® HiTech CU21-3240-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Chemical System
Epoxy
Cure / Technology
 
Industry
 
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MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions