Encapsulants and Potting Compounds from MacDermid Alpha Electronics Solutions

Solder Joint Strengthening Encapsulant -- ALPHA® HiTech™ EN31-4007

 
 
Solder Joint Strengthening Encapsulant -- ALPHA® HiTech™ EN31-4007 -- View Larger Image
Solder Joint Strengthening Encapsulant -- ALPHA® HiTech™ EN31-4007-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Chemical System
Epoxy
Cure / Technology
 
Industry
 
CTE