Encapsulants and Potting Compounds from Henkel Corporation - Electronics

LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) -- 8799575769089


 
 
LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) -- 8799575769089 -- View Larger Image
LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) -- 8799575769089-Image

(Known as HYSOL UF3037 )

LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders.


Specifications

Product Category
Encapsulants and Potting Compounds
Form / Function
Gap Filler, Foam in Place Gasket
Industry
Electronics
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Henkel Corporation - Electronics
Henkel Corporation - Electronics