Encapsulants and Potting Compounds from Henkel Corporation - Electronics

LOCTITE ECCOBOND DP 1003UV -- 8802608316417


 
 
LOCTITE ECCOBOND DP 1003UV -- 8802608316417 -- View Larger Image
LOCTITE ECCOBOND DP 1003UV -- 8802608316417-Image

LOCTITE ECCOBOND DP 1003UV one component material is designed for use as a wire and tab bond lead encapsulant, and gap fillng adhesive. It can be applied by using non-contact dispensing methods. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. It has very high flow to facilitate penetration of small gaps. It can be co-cured with ECCOBOND DP 1002UV for dam and fill applications. It maintains adhesion to silicon, a wide variety of metals and plastics when thermal cycled. It provides environmental and mechanical protection.



Product Category
Encapsulants and Potting Compounds
Form / Function
Gap Filler, Foam in Place Gasket
Composition & Features
Industry
Electronics