Encapsulants and Potting Compounds from Henkel Corporation - Electronics

HYSOL US1150 -- 8802596782081

HYSOL US1150 -- 8802596782081 -- View Larger Image
HYSOL US1150 -- 8802596782081-Image

HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards. It exhibits very little hardness increase when cooled to -75ºC. It can be used for devices in the telecommunications and automotive industries. HYSOL US1150 meets UL 94V-0 rating. The 1 to 4 volume mix ratio makes meter-mix dispensing convenient.


Product Category
Encapsulants and Potting Compounds
Chemical System
Cure / Technology
Two Component  ; Room Temperature Vulcanizing or Curing
Use Temperature
Thermal Conductivity
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Henkel Corporation - Electronics
Henkel Corporation - Electronics