Encapsulants and Potting Compounds from Henkel Corporation - Electronics

LOCTITE ECCOBOND UF 3808 (Known as HYSOL UF3808) -- 8802581086209


 
 
LOCTITE ECCOBOND UF 3808 (Known as HYSOL UF3808) -- 8802581086209 -- View Larger Image
LOCTITE ECCOBOND UF 3808 (Known as HYSOL UF3808) -- 8802581086209-Image

(Known as HYSOL UF3808 )

LOCTITE ECCOBOND UF 3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.


Specifications

Product Category
Encapsulants and Potting Compounds
Form / Function
Gap Filler, Foam in Place Gasket
Industry
Electronics
Similar Products
Henkel Corporation - Electronics