Encapsulants and Potting Compounds from Henkel Corporation - Electronics

LOCTITE ECCOBOND UF 8840 (Known as LOCTITE ECCOBOND UF 8840) -- 8799580127233


 
 
LOCTITE ECCOBOND UF 8840 (Known as LOCTITE ECCOBOND UF 8840) -- 8799580127233 -- View Larger Image
LOCTITE ECCOBOND UF 8840 (Known as LOCTITE ECCOBOND UF 8840) -- 8799580127233-Image

(Known as LOCTITE ECCOBOND UF 8840 )

LOCTITE ECCOBOND UF 8840 liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage. It is formulated to flow consistently without voids on die sizes over 20 x 20mm. It is engineered to withstand the 260°C peak reflow temperature associated with Pb-free solders and copper pillar.


Specifications

Product Category
Encapsulants and Potting Compounds
Form / Function
Gap Filler, Foam in Place Gasket
Industry
Electronics
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Henkel Corporation - Electronics
Henkel Corporation - Electronics