Encapsulants and Potting Compounds from Henkel Corporation - Electronics

LOCTITE ECCOBOND FP4530 (Known as Hysol FP4530) -- 8799543001089


 
 
LOCTITE ECCOBOND FP4530 (Known as Hysol FP4530) -- 8799543001089 -- View Larger Image
LOCTITE ECCOBOND FP4530 (Known as Hysol FP4530) -- 8799543001089-Image

(Known as Hysol FP4530 )

LOCTITE ECCOBOND FP4530 is a fast flow encapsulant material for flip chip underfill applications with a gap of 1 mil. The material is designed to snap cure within 7 minutes at 160°C, even with a preheat application temperature as high as 90°C.


Specifications

Product Category
Encapsulants and Potting Compounds
Form / Function
Gap Filler, Foam in Place Gasket
Industry
 
CTE
 
Similar Products
Henkel Corporation - Electronics
Henkel Corporation - Electronics