Encapsulants and Potting Compounds from Henkel Corporation - Electronics

TECHNOMELT PA 2692

TECHNOMELT PA 2692 -- View Larger Image
TECHNOMELT PA 2692-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Form / Function
Pellets
Chemical System
Polyamide
Cure / Technology
Thermoplastic / Hot Melt
Features
UL Rating
Industry
 
Use Temperature
 
Elongation
 
Water Absorption