Encapsulants and Potting Compounds from Henkel Corporation - Electronics

LOCTITE ECCOBOND UF 2800A reworkable underfill -- 8802603663361


 
 
LOCTITE ECCOBOND UF 2800A reworkable underfill -- 8802603663361 -- View Larger Image
LOCTITE ECCOBOND UF 2800A reworkable underfill -- 8802603663361-Image

LOCTITE ECCOBOND UF 2800A reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is amber in color. It is only available for purchase and use in China


Specifications

Product Category
Encapsulants and Potting Compounds
Form / Function
Gap Filler, Foam in Place Gasket
Industry
Electronics
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Henkel Corporation - Electronics
Henkel Corporation - Electronics