Encapsulants and Potting Compounds from Henkel Corporation - Electronics

LOCTITE ECCOBOND 933 (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant) -- 8799582060545


 
 
LOCTITE ECCOBOND 933 (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant) -- 8799582060545 -- View Larger Image
LOCTITE ECCOBOND 933 (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant) -- 8799582060545-Image

(Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant )

LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring during thermal shock tests. It exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.


Specifications

Product Category
Encapsulants and Potting Compounds
Industry
Electronics
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Henkel Corporation - Electronics
Henkel Corporation - Electronics