Encapsulants and Potting Compounds from Henkel Corporation - Electronics

Hysol E1172A -- 8799536447489


 
 
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Hysol E1172A -- 8799536447489-Image

An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.


Specifications

Product Category
Encapsulants and Potting Compounds
Form / Function
Gap Filler, Foam in Place Gasket
Industry
 
CTE
 
Viscosity
 
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Henkel Corporation - Electronics
Henkel Corporation - Electronics
Henkel Corporation - Electronics