Encapsulants and Potting Compounds from Henkel Corporation - Industrial

Thermal Interface Materials -- BERGQUIST GAP PAD TGP 7000ULM

Thermal Interface Materials -- BERGQUIST GAP PAD TGP 7000ULM -- View Larger Image
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 7000ULM-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
Thermally Conductive
Form / Function
 
Chemical System
 
Use Temperature