Encapsulants and Potting Compounds from Hapco, Inc.

Di-Pak™ Rigid Eletrical Insulating Compound -- R-4307

Di-Pak™ Rigid Eletrical Insulating Compound -- R-4307 -- View Larger Image
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4307-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric
Form / Function
Liquid
Cure / Technology
Thermoset; Two Component  
Industry
Electronics
Use Temperature
338 F (170 C)
Thermal Conductivity
 
Tensile (Break)
 
Elongation
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity