Encapsulants and Potting Compounds from Hapco, Inc.

Di-Coat™ Elastomeric Eletrical Insulating Compound -- E-4669

Di-Coat™ Elastomeric Eletrical Insulating Compound -- E-4669 -- View Larger Image
Di-Coat™ Elastomeric Eletrical Insulating Compound -- E-4669-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric
Form / Function
Liquid
Cure / Technology
Thermoset; Two Component  
Industry
Electronics
Use Temperature
275 F (135 C)
Tensile (Break)
 
Elongation
 
Dielectric Strength
 
Dielectric Constant