Encapsulants and Potting Compounds from Epoxies Etc...
Potting and Encapsulating Epoxy Resin -- 20-3060FR
20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
Specifications
Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermal Insulation
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
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