Encapsulants and Potting Compounds from Epoxies Etc...

Potting and Encapsulating Epoxy Resin -- 20-3060FR

Potting and Encapsulating Epoxy Resin -- 20-3060FR -- View Larger Image
Potting and Encapsulating Epoxy Resin -- 20-3060FR-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermal Insulation
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Features
 
Industry
 
Use Temperature
 
Thermal Conductivity
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity