Encapsulants and Potting Compounds from Epoxies Etc...

Mica Filled Epoxy -- 20-3210

Mica Filled Epoxy -- 20-3210 -- View Larger Image
Mica Filled Epoxy -- 20-3210-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Industry
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity