Encapsulants and Potting Compounds from Epoxies Etc...

Flexible Eposy Resin Potting Compound -- 20-3241


Specifications

Product Category
Encapsulants and Potting Compounds
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  
Industry
Electronics; OEM or Industrial
Use Temperature
 
Thermal Conductivity
 
CTE
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity