Encapsulants and Potting Compounds from Epoxies Etc...
Flexible Eposy Resin Potting Compound -- 20-3241
20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required.
Specifications
Product Category
Encapsulants and Potting Compounds
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component
Industry
Electronics; OEM or Industrial
More Information
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