Encapsulants and Potting Compounds from Epoxies Etc...
Epoxy Potting and Encapsulating Resin -- 20-3220
20-3220 is a filled epoxy resin system that does not contain diluents, plasticizers, or other degrading adulterants. This system was formulated for the encapsulation and potting of miniaturized electronic components and high density circuit packages.
Specifications
Product Category
Encapsulants and Potting Compounds
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
Industry
Electronics
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