Encapsulants and Potting Compounds from Epoxies Etc...

Potting and Encapsulating Epoxy Resin -- 20-3060

Potting and Encapsulating Epoxy Resin -- 20-3060 -- View Larger Image
Potting and Encapsulating Epoxy Resin -- 20-3060-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  
Industry
 
Use Temperature
 
Thermal Conductivity
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity