Encapsulants and Potting Compounds from Epoxies Etc...
Polyurethane potting & encapsulating compound -- 20-2145R




20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties.
20-2145 has very good adhesion to most substrates, low exotherm during cure, low internal stress and minimal shrinkage. It is an excellent choice for potting and encapsulating electronic modules, coils, and micro electronic networks that require thermal cycling extremes and low pressure on delicate components.
Specifications
Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Chemical System
Polyurethane
Composition
Unfilled
Cure / Technology
Two Component ; Room Temperature Vulcanizing or Curing
Industry
Electronics
More Information
Similar Products