Encapsulants and Potting Compounds from Epoxies Etc...
Thermally Conductive Resin -- 50-3185 Catalyst #190
50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.
Specifications
Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
More Information
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