Encapsulants and Potting Compounds from Epoxies Etc...

High temperature epoxy resin system -- 20-3660R

High temperature epoxy resin system -- 20-3660R -- View Larger Image
High temperature epoxy resin system -- 20-3660R-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Chemical System
Epoxy
Cure / Technology
Thermoset; Single Component
Industry
OEM or Industrial
Use Temperature
-4 to 446 F (-20 to 230 C)
Thermal Conductivity
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Water Absorption
 
Viscosity