Encapsulants and Potting Compounds from Epoxies Etc...
Low viscosity epoxy resin -- 20-3652-40
20-3652\40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652\40 is easily machined and exhibits outstanding adhesion to metals, ceramics, and plastics. The Flame Retardant version is 20-3652\40 FR.
Specifications
Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Form / Function
Liquid
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
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