Encapsulants and Potting Compounds from Epoxies Etc...
Thermally conductive polyurethane potting compound -- 50-2368FR




50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties.
This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy. 50-2368 FR is suitable for outdoor use.
For a very fast curing version of this product consider the 50-2370 FR. This product will be tack free in 20 minutes.
Specifications
Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Chemical System
Polyurethane
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
Features
Flame Retardant
Industry
OEM or Industrial
More Information
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