The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR meets the stringent and non-burning requirements of UL 94 V-O.
The 50-2185 has outstanding thermal cycling properties and low embedment stress to sensitive components. This system will maintain its’ integrity over a wide operating temperature range, -50 to 120°C. Its’ low glass transition temperature of -55° makes it an ideal choice for low temperature potting applications.