Encapsulants and Potting Compounds from Epoxies Etc...

Epoxy resin -- 20-3652

Epoxy resin -- 20-3652 -- View Larger Image
Epoxy resin -- 20-3652-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Form / Function
Gel
Chemical System
Epoxy
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Industry
OEM or Industrial
Use Temperature
 
Thermal Conductivity
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Water Absorption
 
Viscosity