Encapsulants and Potting Compounds from Epoxies Etc...

Epoxy Potting and Encapsulating Resin -- 20-3042

Epoxy Potting and Encapsulating Resin -- 20-3042 -- View Larger Image
Epoxy Potting and Encapsulating Resin -- 20-3042-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermal Insulation
Form / Function
Liquid
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Industry
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity