Encapsulants and Potting Compounds from Epoxies Etc...

Elastomeric potting & encapsulating compound -- 20-2121

Elastomeric potting & encapsulating compound -- 20-2121 -- View Larger Image
Elastomeric potting & encapsulating compound -- 20-2121-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Chemical System
Polyurethane
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Industry
Sanitary; OEM or Industrial
Use Temperature
-22 to 257 F (-30 to 125 C)
Thermal Conductivity
 
Tensile (Break)
 
Elongation
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity