Encapsulants and Potting Compounds from Epoxies Etc...

Epoxy potting and encapsulating resin -- 20-3001NC

Epoxy potting and encapsulating resin -- 20-3001NC -- View Larger Image
Epoxy potting and encapsulating resin -- 20-3001NC-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
High Dielectric; Thermally Conductive
Form / Function
Liquid
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Two Component  ; Room Temperature Vulcanizing or Curing
Industry
 
Use Temperature
 
Thermal Conductivity
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant
 
Viscosity