Encapsulants and Potting Compounds from Ellsworth Adhesives

ResinLab EP1112NC Epoxy Encapsulant Part B Clear 5 gal Pail -- EP1112NC CLEAR - B PL

ResinLab EP1112NC Epoxy Encapsulant Part B Clear 5 gal Pail -- EP1112NC CLEAR - B PL -- View Larger Image
ResinLab EP1112NC Epoxy Encapsulant Part B Clear 5 gal Pail -- EP1112NC CLEAR - B PL-Image

Specifications

Manufacturer
Resinlab
Manufacturer Part Number
EP1112NC CLEAR B PL
Product Category
Encapsulants and Potting Compounds
Chemical System
Epoxy
Cure / Technology
Two Component  
Thermal Conductivity
0.1400 W/m-K (0.0809 BTU-ft/hr-ft²-F)
Tensile (Break)
3000 psi (20684 KPa)
Elongation
 
Dielectric Strength
 
Viscosity