Encapsulants and Potting Compounds from Ellsworth Adhesives

ResinLab EP965LVLX Epoxy Encapsulant Part B Black 1 gal Pail -- EP965LVLX BLACK - B GL

ResinLab EP965LVLX Epoxy Encapsulant Part B Black 1 gal Pail -- EP965LVLX BLACK - B GL -- View Larger Image
ResinLab EP965LVLX Epoxy Encapsulant Part B Black 1 gal Pail -- EP965LVLX BLACK - B GL-Image

Specifications

Manufacturer
Resinlab
Manufacturer Part Number
EP965LVLX BLACK B GL
Product Category
Encapsulants and Potting Compounds
Chemical System
Epoxy
Cure / Technology
Two Component  
Thermal Conductivity
0.1300 W/m-K (0.0751 BTU-ft/hr-ft²-F)
Tensile (Break)
4000 psi (27579 KPa)
Elongation
 
Dielectric Strength
 
Viscosity