Encapsulants and Potting Compounds from Ellsworth Adhesives

ResinLab EP965SC7 Epoxy Encapsulant Part B Black 1 gal Pail -- EP965SC7 BLACK - B GL

ResinLab EP965SC7 Epoxy Encapsulant Part B Black 1 gal Pail -- EP965SC7 BLACK - B GL -- View Larger Image
ResinLab EP965SC7 Epoxy Encapsulant Part B Black 1 gal Pail -- EP965SC7 BLACK - B GL-Image

Specifications

Manufacturer
Resinlab
Manufacturer Part Number
EP965SC7 BLACK B GL
Product Category
Encapsulants and Potting Compounds
Chemical System
Epoxy
Cure / Technology
Two Component  
Thermal Conductivity
0.1400 W/m-K (0.0809 BTU-ft/hr-ft²-F)
Tensile (Break)
7500 psi (51711 KPa)
Elongation
 
Dielectric Strength
 
Viscosity