Encapsulants and Potting Compounds from Ellsworth Adhesives

ResinLab EP691 Epoxy Encapsulant Part A Clear 1 qt Can -- EP691 CLEAR - A QT

ResinLab EP691 Epoxy Encapsulant Part A Clear 1 qt Can -- EP691 CLEAR - A QT -- View Larger Image
ResinLab EP691 Epoxy Encapsulant Part A Clear 1 qt Can -- EP691 CLEAR - A QT-Image

Specifications

Manufacturer
Resinlab
Manufacturer Part Number
EP691 CLEAR A QT
Product Category
Encapsulants and Potting Compounds
Chemical System
Epoxy
Cure / Technology
Two Component  
Thermal Conductivity
0.1400 W/m-K (0.0809 BTU-ft/hr-ft²-F)
Tensile (Break)
8500 psi (58606 KPa)
Elongation
 
Dielectric Strength
 
Viscosity