Encapsulants and Potting Compounds from Ellsworth Adhesives

ResinLab EP1121 Epoxy Encapsulant Part B Black 5 gal Pail -- EP1121 BLACK - B PL

ResinLab EP1121 Epoxy Encapsulant Part B Black 5 gal Pail -- EP1121 BLACK - B PL -- View Larger Image
ResinLab EP1121 Epoxy Encapsulant Part B Black 5 gal Pail -- EP1121 BLACK - B PL-Image

Specifications

Manufacturer
Resinlab
Manufacturer Part Number
EP1121 BLACK B PL
Product Category
Encapsulants and Potting Compounds
Chemical System
Epoxy
Cure / Technology
Two Component  
Thermal Conductivity
0.1000 W/m-K (0.0578 BTU-ft/hr-ft²-F)
Tensile (Break)
1500 psi (10342 KPa)
Elongation
 
Dielectric Strength
 
Viscosity