Encapsulants and Potting Compounds from CHT USA Inc.

2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553

2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553 -- View Larger Image
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553-Image

Specifications

Product Category
Encapsulants and Potting Compounds
Type
Thermally Conductive
Cure / Technology
Two Component  ; Addition
Features
Flame Retardant; UL Rating
Industry
Automotive; Electronics; OEM or Industrial
Use Temperature
-67 to 464 F (-55 to 240 C)
Thermal Conductivity
 
Tensile (Break)
 
Elongation
 
Dielectric Strength
 
Viscosity