Rubber Adhesives and Sealants from Epoxies Etc...
PU Potting & Encapsulating Compound -- 20-2353
20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20- 2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature, and low stress on sensitive components.
Specifications
Product Category
Rubber Adhesives and Sealants
Composition
Unfilled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Features
Flexible; High Dielectric; Encapsulant, Potting Compound
Industry
Electronics
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