Rubber Adhesives and Sealants from Epoxies Etc...

PU Potting & Encapsulating Compound -- 20-2353

PU Potting & Encapsulating Compound -- 20-2353 -- View Larger Image
PU Potting & Encapsulating Compound -- 20-2353-Image

Specifications

Product Category
Rubber Adhesives and Sealants
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Features
Flexible; High Dielectric; Encapsulant, Potting Compound
Industry
Electronics
Viscosity
 
Use Temperature
 
CTE
 
Tensile (Break)
 
Elongation
 
Dielectric Constant