Epoxies Etc... Datasheets for Electrical Insulation and Dielectric Materials

Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk.
Electrical Insulation and Dielectric Materials: Learn more

Product Name Notes
10-3001 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility.
10-3003 HV is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable...
10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility.
10-3005 NS and 10-3046 NS are two component fast curing epoxy adhesives. These high bond strength adhesives are 100% solids and therefore contain no solvents. 10-3005 NS and 10-3046 NS...
10-3006 is a new non-sag fast setting patch & repair epoxy system. This material has a convenient 1:1 mix ratio and will not run when used on vertical surfaces. 10-3006...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product...
10-3011 is a two component fast curing epoxy adhesive. This system provides a rapid cure in thin films and at low temperatures.
10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.
10-3018 is a two component epoxy adhesive and sealant. This two component system has excellent chemical and heat resistance. 10-3018 is widely used as a stencil and screen adhesive due...
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to...
10-3026 is a clear, fast setting epoxy resin system. This product forms a semi-flexible and strong bond to metals, pewter, glass, ceramic, felt, concrete, etc. 10-3026 does not contain any...
10-3037 is a thixotropic and general purpose 100% solids epoxy adhesive. This adhesive is easily applied and will not sag or drip. High tensile strength is developed in one day...
10-3050 is a thixotropic, Non-Sag, gel epoxy designed to protect motor windings from abrasives, chemicals, vibration, oils, jet fuels, etc... 10-3050 self levels to a smooth void free coating once...
10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can...
10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with...
10-3213 is a new two part epoxy adhesive system which exhibits high bond strength and outstanding thermal shock resistance. The 10-3213 has proven to be an excellent quick set patch...
10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high...
10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary...
10-3785 is a one component (no mixing necessary) epoxy adhesive. This product maintains exceptionally strong structural bonds over a wide temperature range (-55°C to 150°C). A unique and popular feature...
10-3797 is a one component, fast curing structural adhesive. This epoxy system is a non-sag thixotropic product that cures quickly at low temperatures. 10-3797 is a 100% solids system and...
20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating.
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self...
20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100...
20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does...
20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does...
20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties.
20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries...
20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would...
20-2182 is a unique high performance two component urethane system. The 20-2182 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries...
20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20-...
20-2354 R is a two component, low durometer, potting, casting, and encapsulating compound. This unfilled system provides excellent hydrolytic stability and low moisture permeability. It has outstanding thermal cycling properties,...
20-2355 is an elastomeric polyurethane potting and encapsulating system. This unique formulation is unfilled and repairable. Its low viscosity, low durometer, and room temperature cure make it an ideal candidate...
20-2362 has been formulated to meet the stringent non-burning requirements of UL94 VO. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame retardant, has...
20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm,...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system...
20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that...
20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006...
20-3036 is a light weight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio.
20-3042 is a general purpose rigid epoxy encapsulant designed for ease in handling. This low viscosity system exhibits excellent physical, thermal, and electrical insulation properties.
20-3050 is a heat cure, 100% solids, high performance epoxy system. 20-3050 is a filled system resulting in excellent dimensional stability and extremely low shrinkage. This product has excellent electrical...
20-3060 is a 100% reactive resin which does not contain any solvents, diluents, plasticizers or additives which downgrade physical, thermal, and electrical insulation properties.
20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity...
20-3062 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. Both the 20-3062 and 20-3062 LV, (Low Viscosity version of 20-3062), meet the Food and...
20-3065 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This system is a 100% reactive resin, which does not contain any solvents, plasticizers, or other additives,...
20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance.
20-3068 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. The 20-3068 meets the Food and Drug Administration (FDA) regulations permitting use in food contact...
20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
20-3210 is a mica filled casting, potting, and encapsulating resin system. This epoxy system exhibits excellent physical, thermal, and electrical insulation properties. Since mica is one of the best insulating...
20-3221 is a very low viscosity epoxy potting, casting and encapsulating resin system. 20-3221 is a filled system resulting in excellent dimensional stability and low shrinkage.
20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix...
20-3242FR Epoxy is a two component potting and encapsulating compound. This product has excellent electrical insulation properties and moisture resistance. 20-3242R FR Black and Yellow meet the stringent requirements of...
20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is...
20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to...
20-3652\40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652. This system exhibits excellent physical, thermal, and electrical insulation properties.
20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
30-1100 is a high temperature resistant silicone coating resin. Due to its' excellent adhesion to a variety of substrates, this material is an ideal choice as a barrier, protective, or...
30-1101 is a high temperature resistant silicone coating resin. Due to its' excellent adhesion to a variety of substrates, this material is an ideal choice as a barrier, protective, or...
30-3021 is a low viscosity room temperature cure epoxide coating that exhibits excellent adhesion, electrical insulation, and chemical resistance. This is a two component thermosetting polymer system which forms a...
30-3600 is a two component liquid epoxy system designed as a conformal dip coating on foil, metalized film, ceramic, mica and tantalum capacitors.
50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm,...
50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is...
50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination...
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination...
50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is...
Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications...
The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate...
The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties.
The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer,...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding...
This is a one component insulating epoxy. It is low in viscosity (400cps) and suitable for electronic applications requiring high dielectric properties. This system does not contain volatile organic compounds...
This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability.
Two component high performance polyurethane coating. This room temperature curing system is formulated for applications requiring low embedment stress over a wide range of temperatures, excellent hydrolytic stability, and low...
UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE).
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be...