M-Speed is our complete copper surface treatment process for fabrication of printed circuit boards in applications demanding the lowest signal loss. This uniquely formulated process, from the market leader of innerlayer technologies, provides low surface profiles and reliable adhesion for high frequency applications. M-Speed provides low profile surface topography to ensure maximum signal speeds, meeting the needs of controlled impedance and perfect signal integrity. M-Speed offers superior adhesion and maximum thermal resistance despite lower surface topography and lower peak to valley roughness.