3M boron nitride cooling fillers provide a unique opportunity to improve the efficiency of thermally conductive polymers while maintaining electrical resistivity of an insulator. Ongoing miniaturization and large-scale production of electronic components requires materials that can quickly and effectively dissipate and transfer heat within an extremely small space. On their own, lightweight plastics have limitations when it comes to the transfer of thermal energy, but polymers incorporating 3M boron nitride cooling fillers can achieve thermal conductivities of up to 15 W/m*K in-plane and 4 W/m*K through-plane.
In high performance applications, 3M boron nitride cooling fillers offer a lower cost-in-use than conventional mineral- and oxide-based filled compounds. Our engineered particle geometry provides optimum processability for injection molding and extrusion, even at high loading levels. Boron nitride-filled polymers cool more quickly during production, helping increase throughput. The low density and inherent electrically insulating properties of 3M boron nitride cooling fillers allow for the production of lighter, thinner parts and simpler, more compact designs. They may even eliminate the need for heat sinks, fans or heat-dissipating aluminum foils in some applications.