The MAX6023 is a family of low-dropout, micropower voltage references in a 5-bump, chip-scale package (UCSP™). The MAX6023 series-mode (three-terminal) references, which operate with input voltages from 2.5V to 12.6V (1.25V and 2.048V options) or (VOUT + 0.2V) to 12.6V (all other voltage options), are available with output voltage options of 1.25V, 2.048V, 2.5V, 3.0V, 4.096V, 4.5V, and 5.0V. These devices are guaranteed an initial accuracy of ±0.2% and 30ppm/°C temperature drift over the -40°C to +85°C extended temperature range.
UCSPs offer the benefit of moving to smaller footprint and lower profile devices, significantly smaller than even SC70 or SOT23 plastic surface-mount packages. The significantly lower profile (compared to plastic SMD packages) of the UCSP makes the device ideal for height-critical applications. Miniature UCSP packages also enable device placement close to sources and allow more flexibility in a complex or large design layout.
The MAX6023 voltage references use only 27µA of supply current. And unlike shunt-mode (two-terminal) references, the supply current of the MAX6023 family varies only 0.8µA/V with supply-voltage changes, translating to longer battery life. Additionally, these internally compensated devices do not require an external compensation capacitor and are stable up to 2.2nF of load capacitance. The low-dropout voltage and the low supply current make these devices ideal for battery-operated systems.