Network and Communication Chips from RS Components, Ltd.


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The RN52 Bluetooth audio module provides a fully integrated solution for delivering high-quality stereo audio in a small form factor. It combines a Class 2 Bluetooth radio with an embedded DSP processor, controlled and configured by simple ASCII commands and GPIO.
Bluetooth 3.0 Class 2 transceiver module with 16-bit DSP-based stereo audio CODEC. Compatible with Bluetooth 2.1 + EDR, 1.2, and 1.1. RF Frequency Range: 2.405 to 2.48GHz. RF Output Power: +4dBm. Receiver Sensitivity: -85dBm at 0.1% BER. Modulation: GFSK, DQPSK, 8DPSK. OTA Data Rate: 3Mbps. SPP data connection interface over UART. Embedded Bluetooth stack profiles: SPP, A2DP, HFP/HSP and AVRCP. Audio decoders: SBC, AAC, aptX. Enhanced hands-free voice capability narrowband and wideband CODECs with cVc DSP. Supports iAP profile discovery for Apple iPhone and iPad Bluetooth accessories. Available as an A2DP audio source or sink. External audio CODECs supported via I²S and S/PDIF interface. UART serial interface. USB interface. 16Ω stereo speaker outputs via internal amplifiers. Stereo microphone inputs. PCB antenna. Castellated SMT pads for easy and reliable PCB mounting. Power supply: +3.0V to +3.6Vdc. Operating temperature range: -40 to +85°C. Dimensions: 13.5 x 26 x 2.7mm. Applications: High-quality wireless stereo headsets, Automotive hands free audio kits, Wireless audio docking station for smartphones, High-quality wireless speakers, VoIP handsets, Remote control for media players, Medical data devices
Bluetooth Class = Class 2
Bluetooth Version = 3.0
Maximum Output Power = +4dBm
Receiver Sensitivity = -85dBm
Supported Bus Interfaces = AIO, GPIO, SPI, UART, USB
Dimensions = 26 x 13.5 x 2.7mm
Height = 2.7mm
Length = 26mm
Maximum Operating Temperature = +85°C
Width = 12.75mm


Microchip Technology, Inc.
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Network and Communication Chips
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