End-to-end Electronic Manufacturing Solutions

WORLD electronics offers a complete line of assembly services. Our commitment to quality and service is second to no supplier.

• RoHS (Restriction of Hazardous Substances)
• SMT, Thru Hole, Mixed Technology
• COB, Wire Bonding, MCM, FlipChip
• Integration/Box Build
• AOI and X-Ray Capability
• Burn-In and Temperature Cycling
• Pin Insertion
• Component Programming
• Component Rework Capability
• Component Procurement/Warehousing
• New Product Introduction (NPI), Prototypes

Advanced Manufacturing Services

WORLD electronics' commitment to innovation parallels our customers need to stay ahead of the competition. We work with our suppliers and customers to qualify assembly and test methods for new component packages as well as anticipate technology trends that will improve our manufacturing processes.

Technologies and Capabilities Include:

• 0402 and 0201 package types
• Chip Scale Package (CSP)
• BGA and uBGA double-sided/mirrored BGA assembly
• COB and MCM
• Direct and multiple chip attach
• High pin count press fit
• Gold and aluminum wedge-bonding
• Wire-bonding
• Flex Circuits
• Wave solder
• Selective soldering
• Aqueous cleaning