Filler Alloys and Consumables from RS Components, Ltd.

547275


 
 
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547275-Image

Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications in the electronics and connector industries. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine content: 1.1 %. Class: J-STD-004 ROM1
Wire Diameter = 1.2mm
Percent Lead = 38%
Product Form = Wire
Melting Point = +183 - +190°C
Percent Tin = 60%
Flux Type = Rosin
Product Weight = 500g
Flux Content Percent = 2.6%
Percent Copper = 2%


Specifications

Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Solid wire or rod
Diameter / Thickness
 
Melting Range
 
Solder Alloy
 
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