Henkel North America 291319

Description
A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystal™ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263). Crystal™ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability (RS 229-4308) Wire Diameter = 0.71mm Percent Lead = 40% Product Form = Wire Melting Point = +183 - +188°C Percent Tin = 60% Flux Type = Halide Free Product Weight = 500g
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Product
Description
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 - 2294279 - RS Components, Ltd.
Corby, Northants, United Kingdom
A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystal™ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263). Crystal™ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability (RS 229-4308) Wire Diameter = 0.71mm Percent Lead = 40% Product Form = Wire Melting Point = +183 - +188°C Percent Tin = 60% Flux Type = Halide Free Product Weight = 500g

A careful balance of resins and activators provides clear residues without the need for cleaning in most applications.
Crystalâ„¢ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263). Crystalâ„¢ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability (RS 229-4308)
Wire Diameter = 0.71mm
Percent Lead = 40%
Product Form = Wire
Melting Point = +183 - +188°C
Percent Tin = 60%
Flux Type = Halide Free
Product Weight = 500g

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Technical Specifications

  RS Components, Ltd.
Product Category Filler Alloys and Consumables
Product Number 2294279
Joining Process / Product Form Solid wire or rod
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