Filler Alloys and Consumables from RS Components, Ltd.

547326


 
 
547326 -- View Larger Image
547326-Image

Non-activated No-Clean solder alloy with incorporated resinous flux. Designed for SMD repair applications. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine: 0 %. Flux ratio: 1.5 %. Class J-STD-004 ROL0.
Wire Diameter = 0.5mm
Percent Lead = 40%
Product Form = Wire
Melting Point = +183 - +190°C
Percent Tin = 60%
Flux Type = Rosin
Product Weight = 500g
Flux Content Percent = 2.6%


Specifications

Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Solid wire or rod
Diameter / Thickness
 
Melting Range
 
Solder Alloy
 
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