Filler Alloys and Consumables from RS Components, Ltd.


547269 -- View Larger Image

Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications in the electronics and connector industries. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine content: 1.1 %. Class: J-STD-004 ROM1
Wire Diameter = 1mm
Percent Lead = 40%
Product Form = Wire
Melting Point = +183 - +190°C
Percent Tin = 60%
Flux Type = Rosin
Product Weight = 100g
Flux Content Percent = 2.6%


Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Solid wire or rod
Diameter / Thickness
Melting Range
Solder Alloy
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